Title:
SHAPING DEVICE AND SHAPING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/156002
Kind Code:
A1
Abstract:
Provided are: a shaping device having good thermal energy efficiency and capable of being more compact; and a shaping method. The shaping device (1) comprises: a tape delivery mechanism (6) that delivers a flexible shaping material (10) to a shaping position upon a stage (2); a laser irradiation mechanism (7) that irradiates a laser light on to the shaping material (10) transported to the shaping position; and a travel mechanism (4) that causes the shaping position (P) to move relative to the stage.
Inventors:
KOGA YOSHIRO (JP)
MIYASHITA TAKESHI (JP)
KAMAKURA TOMOYUKI (JP)
MIYASHITA TAKESHI (JP)
KAMAKURA TOMOYUKI (JP)
Application Number:
PCT/JP2015/002040
Publication Date:
October 15, 2015
Filing Date:
April 10, 2015
Export Citation:
Assignee:
SEIKO EPSON CORP (JP)
International Classes:
B23K26/21; B29C67/00; B23K26/34
Domestic Patent References:
| WO2013021173A1 | 2013-02-14 |
Foreign References:
| JP2004001500A | 2004-01-08 | |||
| JP2014028996A | 2014-02-13 | |||
| JPH03189504U |
Other References:
See also references of EP 3130449A4
Attorney, Agent or Firm:
WATANABE, Kazuaki et al. (JP)
Kazuaki Watanabe (JP)
Kazuaki Watanabe (JP)
Download PDF: