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Patent Searching and Data


Title:
SHAPING METHOD AND SHAPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/221563
Kind Code:
A1
Abstract:
This shaping method is characterized by comprising a step for using a first power to form a powder layer, a step for placing a second powder having an average particle size smaller than that of the first powder on a region constituting a portion of the powder layer, and a first heating step for heating the powder layer on which the second powder is placed, wherein the average particle size of the second powder is 1-500 nm inclusive, and the heating in the first heating step occurs at a temperature at which the particles contained in the second powder are sintered or melted.

Inventors:
SUGIYAMA, Akira (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, 〒1468501, JP)
USAMI, Hirokazu (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, 〒1468501, JP)
MASADA, Yohei (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, 〒1468501, JP)
AOTANI, Takaharu (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, 〒1468501, JP)
Application Number:
JP2018/020702
Publication Date:
December 06, 2018
Filing Date:
May 30, 2018
Export Citation:
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Assignee:
CANON KABUSHIKI KAISHA (30-2, Shimomaruko 3-chome Ohta-k, Tokyo 01, 〒1468501, JP)
International Classes:
B22F3/16; B28B1/30; B33Y10/00; B33Y30/00
Domestic Patent References:
WO2015141032A12015-09-24
WO2017006610A12017-01-12
Foreign References:
US20170014910A12017-01-19
JP2013161544A2013-08-19
Attorney, Agent or Firm:
NIWA, Takeshi et al. (Acropolis 21 Bldg. 8th Floor, 4-10 Higashi Nihonbashi 3-chome, Chuo-k, Tokyo 04, 〒1030004, JP)
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