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Patent Searching and Data


Title:
SHAPING-STAGE ADHESIVE SHEET AND LAMINATION SHAPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/187800
Kind Code:
A1
Abstract:
A shaping-stage adhesive sheet according to the present invention has an adhesive layer capable of reducing adhesion with an adhesion reducing measure. For example, the adhesive layer is a heat-releasable adhesive layer (11), and the adhesion reducing measure is heating of the adhesive layer (11). With respect to a shaped article formed on a shaping stage of a lamination shaping device, the shaping-stage adhesive sheet can be suitably used for fixing on the shaping stage during shaping and facilitating removal from the shaping stage after shaping. A lamination shaping device according to the present invention is capable of using the shaping-stage adhesive sheet and provided with a shaping stage and adhesion reducing means for performing the adhesion reducing measure on an adhesive layer of the shaping-stage adhesive sheet affixed to the stage.

Inventors:
OGINO YOSHIKO (JP)
TOSAKI YUTAKA (JP)
KAWANISHI MICHIRO (JP)
MATSUSHITA KIICHIRO (JP)
NONAKA AKIKO (JP)
MURATA AKIHISA (JP)
Application Number:
PCT/JP2017/009038
Publication Date:
November 02, 2017
Filing Date:
March 07, 2017
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C67/00; B33Y30/00; C09J7/10
Domestic Patent References:
WO2007018239A12007-02-15
WO2016047436A12016-03-31
Foreign References:
JP2012506803A2012-03-22
JP2002103460A2002-04-09
JP2005231333A2005-09-02
JP2012149182A2012-08-09
JP2013166910A2013-08-29
JP2008214499A2008-09-18
JP2005179637A2005-07-07
JP2016030398A2016-03-07
JP2004188513A2004-07-08
Other References:
"Tapes for Semiconductor Process", 9 October 2015 (2015-10-09), pages 1 - 6, XP055581081, Retrieved from the Internet [retrieved on 20170328]
See also references of EP 3450143A4
Attorney, Agent or Firm:
GOTO & CO. (JP)
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