Title:
SHEET ARRANGEMENT METHOD AND ARRANGEMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/145399
Kind Code:
A1
Abstract:
This sheet arrangement method for arranging a sheet having an incision in a state where the sheet has been cut at the incision comprises: a sheet forming step for forming the sheet having the incision; a scooping-up step in which a moving plate on which a transfer belt is circumferentially provided is fed between a first stage and the sheet that has the incision and that is placed on the first stage in order to scoop up the sheet that has the incision onto the moving plate via the transfer belt; and an arranging step in which by feeding back the moving plate, the sheet that has the incision and is scooped up onto the moving plate is arranged, on a second stage, in a state where the sheet has been cut at the incision.
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Inventors:
WADA SYUICHI (JP)
KUSAMA HIROYUKI (JP)
ONO TAKESHI (JP)
OHISHI YASUHIKO (JP)
NARA TOMOYUKI (JP)
FURUKAWA TAKASHI (JP)
OHKUMA KAZUO (JP)
KUSAMA HIROYUKI (JP)
ONO TAKESHI (JP)
OHISHI YASUHIKO (JP)
NARA TOMOYUKI (JP)
FURUKAWA TAKASHI (JP)
OHKUMA KAZUO (JP)
Application Number:
PCT/JP2021/001147
Publication Date:
July 22, 2021
Filing Date:
January 15, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B26D7/18; B26D3/08; B26D7/32; B65G47/29; B65G47/52
Domestic Patent References:
| WO2018190233A1 | 2018-10-18 |
Foreign References:
| JP2008222366A | 2008-09-25 | |||
| JP2006321644A | 2006-11-30 | |||
| JP2018203371A | 2018-12-27 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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