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Patent Searching and Data


Title:
SHEET CUTTING DEVICE AND SHEET CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/015379
Kind Code:
A1
Abstract:
A sheet cutting device (15) cutting a sheet (S) along the outer edge of a wafer (W) after the sheet (S) is stuck on the wafer on a sticking table (13). The cutting device (15) comprises a robot body (62) disposed on the side of the sticking table (13) and a cutter blade (63) supported through a tool holding chuck (69) positioned at the tip of the robot body (62). The cutter blade (63) is detachable from the tool holding chuck (69) and formed replaceable, and cuts the sheet (S) in such a state that its attitude is adjusted along a preset moving route.

Inventors:
NONAKA HIDEAKI (JP)
NAKATA KAN (JP)
SUGISHITA YOSHIAKI (JP)
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2006/314484
Publication Date:
February 08, 2007
Filing Date:
July 21, 2006
Export Citation:
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Assignee:
LINTEC CORP (JP)
NONAKA HIDEAKI (JP)
NAKATA KAN (JP)
SUGISHITA YOSHIAKI (JP)
KOBAYASHI KENJI (JP)
International Classes:
B26D7/10; B25J9/06; B26D7/08; B26D7/22
Foreign References:
JP2005123420A2005-05-12
JPH09201794A1997-08-05
JPS6195812A1986-05-14
JPS63109997A1988-05-14
JPH10180682A1998-07-07
JPS63156691A1988-06-29
JPH01143393U1989-10-02
JP2004025438A2004-01-29
JPH0890009A1996-04-09
JP2002255434A2002-09-11
JPH11514618A1999-12-14
Attorney, Agent or Firm:
YAMAGUCHI, Yoshio (Izumi Building 4-17, Tsurumaki 1-chom, Tama-shi Tokyo 34, JP)
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