Title:
SHEET FOR MOLDING/UNDERFILL ENCAPSULATION AND METHOD FOR ENCAPSULATING PRINTED CIRCUIT BORAD USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/024883
Kind Code:
A1
Abstract:
A sheet for molding/underfill encapsulation of a printed circuit board comprising a plurality of electronic components and a substrate and having spaces between the electronic components and the substrate, the sheet being made of a heat-curable resin composition. When examined at 125°C over 150 seconds, the sheet has an increase in viscosity, which is a ratio (V90/V0) of the viscosity V90 measured at 90 seconds after initiation of the examination of the sheet to the viscosity V0 measured at 0 second thereafter, of less than 9.
Inventors:
MORI DAISUKE (JP)
SUGIURA YUKI (JP)
FUJII YASUHITO (JP)
SUGIURA YUKI (JP)
FUJII YASUHITO (JP)
Application Number:
PCT/JP2023/027537
Publication Date:
February 01, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
H01L23/29; C08L101/00; C09K3/10; H01L23/31
Domestic Patent References:
| WO2021029259A1 | 2021-02-18 |
Foreign References:
| JP2018039981A | 2018-03-15 | |||
| JP2021046518A | 2021-03-25 | |||
| JP2010111711A | 2010-05-20 | |||
| JP2015170754A | 2015-09-28 |
Attorney, Agent or Firm:
KAWASAKI & PARTNERS (JP)
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