Title:
SHEET FOR FORMING RESIN FILM FOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2011/125711
Kind Code:
A1
Abstract:
Disclosed is a sheet for forming a resin film for a chip, with which a semiconductor device provided with a gettering function is obtained without performing special treatment to a semiconductor wafer and the chip.
The sheet has a peeling sheet, and a resin film-forming layer, which is formed on the peeling surface of the peeling sheet, and the resin film-forming layer contains a binder polymer component (A), a curing component (B), and a gettering agent (C).
Inventors:
SHINODA TOMONORI (JP)
WAKAYAMA YOJI (JP)
WAKAYAMA YOJI (JP)
Application Number:
PCT/JP2011/057969
Publication Date:
October 13, 2011
Filing Date:
March 30, 2011
Export Citation:
Assignee:
LINTEC CORP (JP)
SHINODA TOMONORI (JP)
WAKAYAMA YOJI (JP)
SHINODA TOMONORI (JP)
WAKAYAMA YOJI (JP)
International Classes:
H01L21/322; C09J7/22; C09J11/04; C09J11/06; C09J11/08; C09J201/00; H01L21/78
Foreign References:
| JP3544362B2 | 2004-07-21 | |||
| JP2006249415A | 2006-09-21 | |||
| JP2005322738A | 2005-11-17 |
Attorney, Agent or Firm:
MAEDA, Hitoshi et al. (JP)
Hitoshi Maeda (JP)
Hitoshi Maeda (JP)
Download PDF:
Claims: