Title:
SHEET HAVING ADHESIVE RESIN LAYER ATTACHED THERETO, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/172328
Kind Code:
A1
Abstract:
[Problem] To provide: a sheet having an adhesive resin layer attached thereto, which enables the transfer of chip-like components while keeping the chip-like components in a nicely arranged state; and a method for producing a semiconductor device using the sheet.
[Solution] The sheet having an adhesive resin layer attached thereto according to the present invention comprises a base and an adhesive resin layer laminated on the base, wherein the rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70˚C for 1 minute is -0.5 to 0.5% and the bending resistance of the base is 80 mm or more.
Inventors:
HORIGOME KATSUHIKO (JP)
SATO AKINORI (JP)
NEZU YUSUKE (JP)
SATO AKINORI (JP)
NEZU YUSUKE (JP)
Application Number:
PCT/JP2013/063379
Publication Date:
November 21, 2013
Filing Date:
May 14, 2013
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J7/38; C09J201/00; H01L21/52
Foreign References:
JP2003138228A | 2003-05-14 | |||
JP2004256595A | 2004-09-16 | |||
JP2005272724A | 2005-10-06 | |||
JP2004338289A | 2004-12-02 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
Maeda and a Suzuki international patent business corporation (JP)
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