SHEET MATERIAL AND ITS USE IN CIRCUIT BOARDS

Title:

SHEET MATERIAL AND ITS USE IN CIRCUIT BOARDS

Document Type and Number:

WIPO Patent Application WO2003022020

Kind Code:

A3

Abstract:

A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

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Inventors:

SAMUELS MICHAEL R
KAHN SUBHOTOSH
MIKHAIL LEVIT R

Application Number:

PCT/US2002/027546

Publication Date:

October 09, 2003

Filing Date:

August 29, 2002

Export Citation:

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Assignee:

DU PONT (US)

International Classes:

B32B5/24; B29B13/10; B32B5/28; B32B15/14; B32B27/12; D04H1/00; D04H13/00; H01L23/14; H05K1/03; (IPC1-7): B32B5/14; B32B27/04

Domestic Patent References:

WO1988004165A1

1988-06-16

Other References:

DATABASE WPI Section Ch Week 197844, Derwent World Patents Index; Class A94, AN 1978-79271A, XP002222617
DATABASE WPI Section Ch Week 199548, Derwent World Patents Index; Class A28, AN 1995-371217, XP002222618

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