Title:
SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/190329
Kind Code:
A1
Abstract:
A sheet molding compound which is a thickened product of an epoxy resin composition that contains component (A), component (B) and component (C), and wherein: the component (A) is an epoxy resin that is in a liquid state at 25°C; the component (B) is an acid anhydride; and the component (C) is an epoxy resin curing agent. With respect to the thickened product, an ester is formed of at least some of the epoxy groups of the component (A) and at least some of the carboxy groups derived from the component (B).
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Inventors:
OOTA AKIRA (JP)
ICHINO MASAHIRO (JP)
TERANISHI TAKUYA (JP)
ICHINO MASAHIRO (JP)
TERANISHI TAKUYA (JP)
Application Number:
PCT/JP2018/015027
Publication Date:
October 18, 2018
Filing Date:
April 10, 2018
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08J5/24; C08G59/42
Domestic Patent References:
| WO2013115152A1 | 2013-08-08 | |||
| WO2015001764A1 | 2015-01-08 | |||
| WO2017150521A1 | 2017-09-08 |
Foreign References:
| JP2008038082A | 2008-02-21 | |||
| JP2011089071A | 2011-05-06 | |||
| JPS6178841A | 1986-04-22 | |||
| JP2002145986A | 2002-05-22 | |||
| JP2014185256A | 2014-10-02 | |||
| JP2017079132A | 2017-04-27 | |||
| JPS58191723A | 1983-11-09 | |||
| JPH0488011A | 1992-03-19 | |||
| JPH0288684A | 1990-03-28 | |||
| JPH0288685A | 1990-03-28 | |||
| JPH02286722A | 1990-11-26 | |||
| JP2004189811A | 2004-07-08 | |||
| JP2004043769A | 2004-02-12 | |||
| JP2001354788A | 2001-12-25 |
Other References:
MASAKI SHIMBO: "Epoxy Resin Handbook", 25 December 1987, NIKKAN KYOGYO SHIMBUN, LTD., pages: 155
See also references of EP 3611210A4
See also references of EP 3611210A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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