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Title:
SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/050200
Kind Code:
A1
Abstract:
The present invention provides a sheet molding compound which is able to be suppressed in the formation of burrs during press molding, while exhibiting excellent fluidity and fast curing properties of a matrix resin during the press molding, and which enables the achievement of a fiber-reinforced composite material that has excellent mold releasability, mechanical characteristics and heat resistance. A sheet molding compound according to the present invention contains an epoxy resin composition and reinforcing fibers; the gel time of the epoxy resin composition at 140°C is from 30 seconds to 140 seconds; the curing reaction initiation temperature of the epoxy resin composition is from 70°C to 115°C; and if b1 is the viscosity of the epoxy resin composition at 30°C in 7 days after the preparation and b2 is the viscosity of the epoxy resin composition at 30°C in 14 days after the preparation, b1 and b2 satisfy b2/b1 ≤ 5.

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Inventors:
OOTA AKIRA (JP)
OGASAWARA HAYATO (JP)
Application Number:
PCT/JP2019/034369
Publication Date:
March 12, 2020
Filing Date:
September 02, 2019
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08J5/24; C08G59/42; C08K5/09; C08K7/02; C08L63/00
Domestic Patent References:
WO2017150521A12017-09-08
WO2015001764A12015-01-08
WO2018190329A12018-10-18
WO2008077836A22008-07-03
Foreign References:
JP2002012649A2002-01-15
JPH11302507A1999-11-02
JP2014185256A2014-10-02
JPS6178841A1986-04-22
JP2002145986A2002-05-22
JP2000309626A2000-11-07
JP2018165832A2018-10-25
JPS58191723A1983-11-09
JPH0488011A1992-03-19
JPH0288684A1990-03-28
JPH0288685A1990-03-28
JPH02286722A1990-11-26
JP2004189811A2004-07-08
JP2004043769A2004-02-12
JP2001354788A2001-12-25
Other References:
MASAKI SHIMBO: "Nikkan Kogyo Shimbun", 25 December 1987, article "Epoxy Resin Handbook", pages: 155 - 156
See also references of EP 3848405A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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