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Title:
SHEET FOR PACKAGING ELECTRONIC PART
Document Type and Number:
WIPO Patent Application WO/2022/149420
Kind Code:
A1
Abstract:
The present invention provides a sheet for packaging an electronic part, the sheet including a base material sheet having at least one base material layer that contains: a thermoplastic resin (I); and a resin (II) containing at least one copolymer selected from between an alkyl (meth)acrylate ester copolymer (A) and a styrene-acrylonitrile copolymer (B) which have a weight average molecular weight of 700,000-4,300,000. The sheet for packaging an electronic part can effectively suppress the occurrence of fluff and burrs.

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Inventors:
SAITO TAKESHI (JP)
INODA IKUKA (JP)
YANAKA RYOSUKE (JP)
Application Number:
PCT/JP2021/046064
Publication Date:
July 14, 2022
Filing Date:
December 14, 2021
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B65D65/40; B65D75/36; B65D85/38
Domestic Patent References:
WO2006030871A12006-03-23
WO2012046807A12012-04-12
Foreign References:
JP2008074408A2008-04-03
JP2017205941A2017-11-24
JP2004091691A2004-03-25
JP2011111171A2011-06-09
KR20080041960A2008-05-14
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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