Title:
SHEET FOR PROTECTING ELECTRONIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/063052
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a sheet for application to component-mounting surfaces of electronic substrates and for thereby protecting the electronic substrates; and an electronic substrate protected by the sheet. This sheet for protecting electronic substrates comprises a base film and a pressure-sensitive adhesive layer, and is characterized in that the pressure-sensitive adhesive layer has a thickness of 500 μm or larger. The electronic substrate according to the present invention is characterized by including this sheet for protecting electronic substrates.
Inventors:
TOYAMA SHIGEKI (JP)
Application Number:
PCT/JP2022/035508
Publication Date:
April 20, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
PRINTEC CORP (JP)
International Classes:
C09J7/38; B32B27/00; C08L33/04; C08L45/00; C08L57/02; C08L63/00; C08L65/00; C08L93/04; C08L101/00; C09J7/25; C09J11/06; C09J11/08; C09J201/00; H05K3/28
Foreign References:
| JP2019189853A | 2019-10-31 | |||
| US20110256382A1 | 2011-10-20 | |||
| JP2017115031A | 2017-06-29 | |||
| JP2011096988A | 2011-05-12 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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