Title:
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/025661
Kind Code:
A1
Abstract:
A sheet for sealing is for embedding a semiconductor chip, and is characterized in that the surface specific resistance value at at least one surface is 1.0 × 1012.
Inventors:
SHIGA GOJI (JP)
MIZUNO KOJI (JP)
MIZUNO KOJI (JP)
Application Number:
PCT/JP2014/069220
Publication Date:
February 26, 2015
Filing Date:
July 18, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/56; B32B27/18; C09J7/10; C09J201/00; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| WO2005105919A1 | 2005-11-10 |
Foreign References:
| JP2008150438A | 2008-07-03 | |||
| JP2010109383A | 2010-05-13 | |||
| JP2005166904A | 2005-06-23 | |||
| JPH11198964A | 1999-07-27 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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