Title:
SHEET FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2017/061132
Kind Code:
A1
Abstract:
This sheet for semiconductor processing is provided with: a base; an unevenness absorption layer that is provided on one surface of the base; and an adhesive layer that is provided on the unevenness absorption layer. The adhesive layer is formed of an energy ray-curable adhesive; and the adhesive layer has a breaking stress of 10 MPa or more after energy ray curing.
Inventors:
KAKIUCHI YASUHIKO (JP)
AKUTSU TAKASHI (JP)
BANDOU SAYAKA (JP)
KOMASU YUICHIRO (JP)
AKUTSU TAKASHI (JP)
BANDOU SAYAKA (JP)
KOMASU YUICHIRO (JP)
Application Number:
PCT/JP2016/059803
Publication Date:
April 13, 2017
Filing Date:
March 28, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; C08F2/46; C09J7/20; C09J7/29; C09J133/00; H01L21/683
Foreign References:
| JP2009138183A | 2009-06-25 | |||
| JP2013087131A | 2013-05-13 | |||
| JP2005048039A | 2005-02-24 | |||
| JP2014063803A | 2014-04-10 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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