Title:
SHEET USED FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SHEET USED FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP EQUIPPED WITH FILM-LIKE ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2021/193923
Kind Code:
A1
Abstract:
A sheet for manufacturing a semiconductor device, the sheet comprising: a label part that is to be pasted on a semiconductor wafer or a semiconductor chip; and an outer peripheral part provided to at least a portion outside the label part, wherein the label part and the outer peripheral part are each provided with a base material, a pressure-sensitive adhesive layer, an intermediate layer, and a film-like adhesive agent, the base material is configured to have laminated thereon the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive agent, and a release film in this sequence, a groove in which the intermediate layer and the film-like adhesive agent are not laminated is provided between the label part and the outer peripheral part, and the intermediate layer contains, as a main ingredient, a non-silicon-based resin having a weight average molecular weight of 100,000 or less.
Inventors:
ADACHI ISSEI (JP)
IWAYA WATARU (JP)
SATO YOSUKE (JP)
IWAYA WATARU (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2021/012888
Publication Date:
September 30, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/28; C08L31/04; C08L83/04; H01L21/301
Domestic Patent References:
| WO2018179475A1 | 2018-10-04 |
Foreign References:
| JP2011208152A | 2011-10-20 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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