Title:
SHEET FOR WORKPIECE PROCESSING AND METHOD FOR PRODUCING PROCESSED WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2019/111758
Kind Code:
A1
Abstract:
This sheet for workpiece processing is provided with a substrate and an adhesive layer, wherein the adhesive layer is composed of an active energy ray-curable adhesive, the water contact angle of the adhesive layer is 50-80°, and the adhesion reduction rate of the sheet for workpiece processing is 20-50%, the adhesion reduction rate being calculated from the equation, adhesion reduction rate (%)={(F1-F2)/F1}×100, where F1 is adhesion to a silicon wafer and F2 is adhesion to a silicon wafer when the sheet for workpiece processing is immersed in distilled water having a temperature of 23°C for 12 hours and then dried at 23°C for 24 hours. By using this sheet for workpiece processing, an adhesive derived from the adhesive layer which has been attached to an object to be cut can be favorably removed from the object to be cut by means of flowing water when the object to be cut, such as a semiconductor wafer, is processed, while suppressing infiltration of water at interfaces between the sheet for workpiece processing and the object to be cut or resultant chips.
Inventors:
OGASAWARA TAKAFUMI (JP)
SAKAMOTO MISAKI (JP)
SAIKI NAOYA (JP)
SAKAMOTO MISAKI (JP)
SAIKI NAOYA (JP)
Application Number:
PCT/JP2018/043551
Publication Date:
June 13, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J133/04
Domestic Patent References:
| WO2008133104A1 | 2008-11-06 | |||
| WO2016140176A1 | 2016-09-09 |
Foreign References:
| JP2007220694A | 2007-08-30 | |||
| JP2011184576A | 2011-09-22 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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