Title:
SHIELD FILM, SHIELDED PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2013/077108
Kind Code:
A1
Abstract:
In order to provide a shield film, a shielded printed wiring board, and a method for manufacturing the shield film, said shield film excellently blocking electric field waves, magnetic field waves, and electromagnetic waves, which travel from one surface side to the other surface side of the shield film, and having excellent transmitting characteristics, a metal layer (3), which has a layer thickness of 0.5-12 μm, and an anisotropic conductive adhesive layer (4), which has anisotropic conductivity wherein an electrically conductive state is ensured merely in the thickness direction, are provided in a laminated state, and electric field waves, magnetic field waves, and electromagnetic waves, which travel from one surface side to the other surface side of a shield film, are excellently blocked.
Inventors:
TAJIMA HIROSHI (JP)
YAMAUCHI SIROU (JP)
KAMINO KENJI (JP)
WATANABE MASAHIRO (JP)
YAMAUCHI SIROU (JP)
KAMINO KENJI (JP)
WATANABE MASAHIRO (JP)
Application Number:
PCT/JP2012/076473
Publication Date:
May 30, 2013
Filing Date:
October 12, 2012
Export Citation:
Assignee:
TATSUTA DENSEN KK (JP)
International Classes:
B32B7/02; H05K9/00; B32B15/08; H05K1/02
Foreign References:
| JP2007294918A | 2007-11-08 | |||
| JP2008120081A | 2008-05-29 | |||
| JP2009206188A | 2009-09-10 | |||
| JP2009200113A | 2009-09-03 |
Attorney, Agent or Firm:
KAJI, Yoshiyuki et al. (JP)
梶 Yoshiyuki (JP)
梶 Yoshiyuki (JP)
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Claims:
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