Title:
SHIELD STRUCTURE IN ELECTRONIC DEVICE AND METHOD FOR OPERATING SAME
Document Type and Number:
WIPO Patent Application WO/2022/255847
Kind Code:
A1
Abstract:
Various embodiments of the present disclosure relate to a package structure that allows a shield used for noise attenuation in an electronic device with high density of arrangement of components to be used for other purposes, and to a method for operating the package structure to prevent noise radiation or detect defects in a manufacturing process in advance. To this end, the electronic device comprises: a printed circuit board (PCB); and a package disposed on the PCB, wherein the package includes a stacked structure in which a grounding pad and at least one shield pad are connected on the PCB, and a plurality of grounding layers are stacked so as to be electrically connected to the grounding pad through at least one via hole; has at least one component disposed on the uppermost surface on which the plurality of grounding layers are stacked, and a shield formed such that the at least one component is not exposed to the outside; includes a first terminal electrically connected to the shield through a first conductor wire, a second terminal electrically connected to one of the plurality of grounding layers through a second conductor wire, and a third terminal electrically connected to the shield pad through a third conductor wire; and may include at least one switch element disposed on the uppermost surface such that the first terminal is selectively connected to the second terminal or the third terminal so that the shield can be connected to one of the one grounding layer or the shield pad. Various other embodiments can be possible.
Inventors:
KIM JONGHYUK (KR)
LEE SANGDEOK (KR)
CHOI WOOSUNG (KR)
LEE SANGDEOK (KR)
CHOI WOOSUNG (KR)
Application Number:
PCT/KR2022/007953
Publication Date:
December 08, 2022
Filing Date:
June 03, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; H01L23/552; H05K1/02; H05K1/11
Foreign References:
| KR20190025363A | 2019-03-11 | |||
| JP2008244289A | 2008-10-09 | |||
| JP2009218258A | 2009-09-24 | |||
| KR101961316B1 | 2019-03-25 | |||
| JP2011187779A | 2011-09-22 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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