Title:
SHIELDED CONDUCTING PATH
Document Type and Number:
WIPO Patent Application WO/2019/031167
Kind Code:
A1
Abstract:
The present invention reduces the height of a shielded conducting path and improves heat dissipating functions of the shielded conducting path. A shielded conducting path (W) is formed by disposing a plurality of conducting members (1) in parallel to each other, each of said conducting members being formed by disposing a conductor section (2), an insulating section (3), and a shield section (4) from a center portion toward the outer peripheral side. At least one of the conductor section (2), insulating section (3) and shield section (4) is formed of a shape-holding member that can hold each of the conducting members (1) in a set shape.
Inventors:
NAKAI HIROKAZU (JP)
Application Number:
PCT/JP2018/026807
Publication Date:
February 14, 2019
Filing Date:
July 18, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01B7/00; H01B7/02; H01B7/18; H01B7/20; H05K9/00
Domestic Patent References:
| WO2013137230A1 | 2013-09-19 |
Foreign References:
| JP2016136460A | 2016-07-28 | |||
| JP2015088251A | 2015-05-07 | |||
| JP2014123478A | 2014-07-03 | |||
| JP2017099155A | 2017-06-01 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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