SHIELDING FILM INCLUDING PLURALITY OF LAYERS AND ELECTRONIC DEVICE USING THE SAME

Title:

SHIELDING FILM INCLUDING PLURALITY OF LAYERS AND ELECTRONIC DEVICE USING THE SAME

Document Type and Number:

WIPO Patent Application WO/2020/091442

Kind Code:

A1

Abstract:

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

Inventors:

LEE MYEONGGIL (KR)
PARK HYEIN (KR)
LIM JAEDEOK (KR)
MOON JIHYE (KR)
YANG CHEEHWAN (KR)
YOO JANGSUN (KR)
LEE KWANGYONG (KR)

Application Number:

PCT/KR2019/014560

Publication Date:

May 07, 2020

Filing Date:

October 31, 2019

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H05K9/00

Domestic Patent References:

WO2017209427A1	2017-12-07
WO2017188615A1	2017-11-02

Foreign References:

US20180235078A1	2018-08-16
JP2011018873A	2011-01-27
US20140008013A1	2014-01-09
KR100618085B1	2006-08-29
KR101250677B1	2013-04-03
US20180235078A1	2018-08-16
US20180131087A1	2018-05-10
US20010033478A1	2001-10-25
KR20180068312A	2018-06-21
JP2011018873A	2011-01-27
US20150282394A1	2015-10-01
JP2005064266A	2005-03-10
US20100319981A1	2010-12-23

Other References: