Title:
SHOT PEENING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/074340
Kind Code:
A1
Abstract:
Disclosed is a shot peening apparatus which prevents shot from scattering around a shot peening area according to the shape of the portion to be shot peened. For this purpose, the shot peening apparatus, which sends shot (B) so as to impact a weld area (W) and provide compressive stress, is provided with a kinetic energy providing means (26) for providing kinetic energy to the shot (B) by means of a vibrator (26b); and an enclosure means for enclosing the shot peening area (U), which includes the weld area (W), and also an area around the vibrator (26b), and keeping the shot (B) in the areas thus enclosed while changing states according to the shape of the shot peening area (U).
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Inventors:
FUJITA, Jun (())
Application Number:
JP2010/069502
Publication Date:
June 23, 2011
Filing Date:
November 02, 2010
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-chome Minato-k, Tokyo 15, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
International Classes:
B24C1/10; B23K31/00; B24C9/00
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (Sakai International Patent Office, Kasumigaseki Building 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 〒1006020, JP)
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