SHRINK FILM HAVING CONDUCTIVE CIRCUIT AND PRODUCTION METHOD THEREFOR

WIPO Patent Application WO/2017/056609

A1

[Problem] To provide: a shrink film having a conductive circuit capable of following a three-dimensional curved surface even when the shrink film is caused to shrink; and a production method for the shrink film having a conductive circuit, whereby the shrink film does not shrink during the production process. [Solution] This production method for a shrink film (3) having a conductive circuit is configured so as to include: a step in which a transfer layer (10) including a conductive circuit layer (14) formed using a stretchable ink is formed upon a base sheet (11) and a transfer sheet (1) is obtained; and a step in which the transfer sheet (1) and a shrink base material (2) are laminated, heat and pressure are applied to the laminate, the transfer layer (10) is transferred to the shrink base material (2), and the base sheet (11) is removed from the laminate. In addition, this shrink film (3) having a conductive layer is configured so as to include: the shrink base material (2); and the conductive circuit layer (14) formed, using stretchable ink, upon the shrink base material (2).

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TANIGUCHI CHUZO (JP)
NISHIKAWA TETSU (JP)
NAKAMURA AKIHISA (JP)
NAKAGAWA HIDEYUKI (JP)
MIYASHITA SHUHEI (JP)

PCT/JP2016/069456

April 06, 2017

June 30, 2016

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NISSHA PRINTING (JP)

G06K19/077; B32B3/14; B32B7/02; B44C1/17; B65D23/08; G06K19/04; H05K3/20; G09F3/00; G09F3/04

WO2013145312A1

2013-10-03

JP2006305860A	2006-11-09
JP3173004U	2012-01-19
JP2004020771A	2004-01-22

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