Title:
SHRINK FILM HEAT-SHRINKING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/208155
Kind Code:
A1
Abstract:
The present invention achieves ideal fitting of shrink film by using a combination of heat-shrinking with a first steam of a relatively low temperature and heat-shrinking with a second steam of a relatively high temperature according to the shape of the article on which the shrink film is to be fitted. A shrink film heat-shrinking device (10) for fitting a shrink film (S) around an article (B) by shrinking the film using heat. The device is provided with a partial shrinkage zone (Z1) for shrinking a portion of the shrink film and an overall shrinkage zone (Z2) for shrinking the majority of the whole shrink film. In the partial shrinkage zone (Z1), the shrink film is fixed to the article by spraying a first steam of a relatively low temperature on the shrink film to partially shrink the film. In the overall shrinkage zone (Z2), the shrink film is fitted on the article by spraying a second steam of a relatively high temperature on the shrink film to shrink the film overall.
Inventors:
UETSUKI AKIRA (JP)
Application Number:
PCT/JP2014/058057
Publication Date:
December 31, 2014
Filing Date:
March 24, 2014
Export Citation:
Assignee:
FUJISEAL INTERNATIONAL INC (JP)
International Classes:
B65B53/02; B65B53/00; B65B53/04
Domestic Patent References:
| WO2012154047A1 | 2012-11-15 | |||
| WO2012154048A1 | 2012-11-15 |
Foreign References:
| JP2008150063A | 2008-07-03 | |||
| JP3141599U | 2008-05-08 | |||
| JPH07187148A | 1995-07-25 | |||
| JPH07329933A | 1995-12-19 | |||
| JP2000326934A | 2000-11-28 | |||
| JPS5984722A | 1984-05-16 |
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