Title:
SHRINKING DEVICE AND SHRINKING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/080172
Kind Code:
A1
Abstract:
Provided are a shrinking device and a shrinking method with which: a heat shrinkable film can be favorably shrunk using hot air with a stable temperature; heat shrinkable film can be fitted on an object to be packaged in a reliably positioned state; and higher quality of external appearance can be obtained. The shrinking device 10 is provided with: a ring-shaped body 50 that can be relatively raised and lowered around a heat shrinkable film 11; a ring-shaped flow path 61 formed inside the ring-shaped body 50 for causing hot air to flow along the circumferential direction of the ring-shaped body 50; a jetting port 55 capable of jetting hot air from the ring-shaped flow path 61 inward in the radial direction of the ring-shaped body 50; a discharge port 53 capable of discharging the hot air from the ring-shaped flow path 61 in a direction differing from the direction towards the heat shrinkable film; and an outlet-switching means 70 for switching the hot air outlet to either the jetting port 55 or the discharge port 53 according to the height of the ring-shaped body 50 with respect to the heat shrinkable film 11.
Inventors:
YAMASAKI HIROAKI (JP)
Application Number:
PCT/JP2015/080543
Publication Date:
May 26, 2016
Filing Date:
October 29, 2015
Export Citation:
Assignee:
KEWPIE CORP (JP)
International Classes:
B65B53/00; B65B53/02
Domestic Patent References:
WO2015083755A1 | 2015-06-11 |
Foreign References:
JPH07187147A | 1995-07-25 | |||
JPH07291235A | 1995-11-07 | |||
JPH09202314A | 1997-08-05 | |||
JP2010070247A | 2010-04-02 |
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