Title:
SHUNT POWER CONNECTION FOR AN INTEGRATED CIRCUIT PACKAGE
Document Type and Number:
WIPO Patent Application WO2002080640
Kind Code:
A3
Abstract:
An apparatus includes a socket and a housing. The socket and the housing can define an interior region for receiving an integrated circuit package. The housing includes a conductive member with a first portion exposed adjacent a bottom surface of the housing and a second portion at a side surface adjacent the interior region. The first portion can be electrically in contact with a printed circuit board. The second portion can be electrically in contact with a conductive member at a side surface of the integrated circuit package.
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| JPH01206585 | ELECTRIC CONNECTING APPARATUS |
| JP2636748 | CHIP CARRIER AND CHIP RETENTION METHOD |
Inventors:
FIGUEROA DAVID G
LI YUAN-LIANG
XIE HONG
LI YUAN-LIANG
XIE HONG
Application Number:
PCT/US2002/004140
Publication Date:
January 03, 2003
Filing Date:
February 11, 2002
Export Citation:
Assignee:
INTEL CORP (US)
International Classes:
H01R33/76; H01L23/50; H01R12/00; H05K7/10; H05K1/02; (IPC1-7): H05K7/10; H01L23/50
Foreign References:
| US3910664A | 1975-10-07 | |||
| US6184477B1 | 2001-02-06 | |||
| US5895230A | 1999-04-20 |
Other References:
See also references of EP 1374652A2
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