Title:
SIDE FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR REMOVING SIDE FILLING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/157472
Kind Code:
A1
Abstract:
Provided is a side filling resin composition which can impart excellent thermal shock resistance to a semiconductor device even when a peripheral edge portion of the surface facing a base material in a mounting component of the semiconductor device is reinforced by side-filling, and which has excellent side fill repairability when a defect of the mounting component is repaired. A side filling resin composition is used to prepare a side filling material (4) interposed between a base material (2) and a peripheral edge portion of the surface facing the base material (2) in a mounting component (3) surface-mounted on the base material (2), and has photocurability.
Inventors:
FUKAMOTO YUSUKE
YAMADA YASUSHI
MAEDA YASUAKI
YAMADA YASUSHI
MAEDA YASUAKI
Application Number:
PCT/JP2021/003158
Publication Date:
August 12, 2021
Filing Date:
January 29, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/29; C08G59/40; C08G65/18; C08K3/013; C08L63/00; C08L71/00; C08L101/00; H01L21/60; H01L23/31; H05K7/12
Domestic Patent References:
| WO2019098053A1 | 2019-05-23 | |||
| WO2018110550A1 | 2018-06-21 |
Foreign References:
| JP2004273554A | 2004-09-30 | |||
| US20180259729A1 | 2018-09-13 | |||
| JP2005105243A | 2005-04-21 | |||
| JP2009007467A | 2009-01-15 | |||
| JP2013178378A | 2013-09-09 | |||
| JP2019041097A | 2019-03-14 | |||
| JPH08213428A | 1996-08-20 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF:
Previous Patent: BASE STATION DEVICE, WIRELESS COMMUNICATION SYSTEM, TERMINAL DEVICE, PROCESSING METHOD THEREFOR, AND...
Next Patent: REFRIGERATOR
Next Patent: REFRIGERATOR