Title:
SIDE INCIDENCE IMAGE SENSORS WITH PROTRUDING INTEGRATED CIRCUIT CHIPS
Document Type and Number:
WIPO Patent Application WO/2024/044925
Kind Code:
A1
Abstract:
A system with an image sensor including: M metal layers (i) and M radiation detectors (i), i=1, …, M. M is an integer greater than 1. The radiation detector (i) includes a radiation absorption layer (i) and IC chips (i, j), j=1, …, Ni. Ni, i=1, …, M are positive integers. The metal layers and the radiation absorption layers together form a stack of layers. There is a best-fit plane of all sensing elements of a radiation detector of the radiation detectors. Each IC chip of the IC chips (i, j), j=1, …, Ni at least partially overlaps the radiation absorption layer (i) in a direction perpendicular to the best-fit plane. There exists a first plane perpendicular to the best-fit plane that intersects all the integrated circuit chips, and does not intersect any radiation absorption layer of the radiation absorption layers.
Inventors:
CAO PEIYAN (CN)
LIU YURUN (CN)
LIU YURUN (CN)
Application Number:
PCT/CN2022/115652
Publication Date:
March 07, 2024
Filing Date:
August 30, 2022
Export Citation:
Assignee:
SHENZHEN XPECTVISION TECH CO LTD (CN)
International Classes:
G01T1/20; H01J37/295; H05K1/02
Foreign References:
| US20200264321A1 | 2020-08-20 | |||
| CN110291423A | 2019-09-27 | |||
| CN112384827A | 2021-02-19 | |||
| CN112673286A | 2021-04-16 | |||
| US20180366511A1 | 2018-12-20 |
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