Title:
SIGNAL PROCESSING DEVICE AND SIGNAL PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251005
Kind Code:
A1
Abstract:
The signal processing device according to the present technique is provided with: an approximate curved surface rendering unit having a first layered autoencoder pretrained using, as learning input data, coordinate data of each element of an object consisting of a plurality of elements, the approximate curved surface rendering unit being configured to obtain, using the coordinate data of each element as input data, approximate curved surface data of an approximate curved surface rendering of the object in an intermediate layer of the first layered autoencoder; and a geometric modulation processing unit having a second layered autoencoder machine-learned using the approximate curved surface data as learning input data and using, as training data, a result of performing geometric modulation processing on the object through coordinate conversion of each element, the geometric modulation processing unit being configured to perform geometric modulation processing on the approximate curved surface data using the second layered autoencoder.
Inventors:
ARAI HIROSHI (JP)
OHTSUKA YURIKO (JP)
NISHI KENICHIRO (JP)
MASUURA TAKESHI (JP)
OKIYAMA NORIMITSU (JP)
MATSUI YUJI (JP)
TAKASHIMA SATOSHI (JP)
OHTSUKA YURIKO (JP)
NISHI KENICHIRO (JP)
MASUURA TAKESHI (JP)
OKIYAMA NORIMITSU (JP)
MATSUI YUJI (JP)
TAKASHIMA SATOSHI (JP)
Application Number:
PCT/JP2021/016039
Publication Date:
December 16, 2021
Filing Date:
April 20, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G06T3/40; G06T7/00; G06T5/00; G06T7/60; H04N5/232
Domestic Patent References:
| WO2019092900A1 | 2019-05-16 |
Foreign References:
| JP2020009203A | 2020-01-16 | |||
| JP2018136430A | 2018-08-30 | |||
| JP2005092465A | 2005-04-07 |
Attorney, Agent or Firm:
IWATA, Masanobu et al. (JP)
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