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Patent Searching and Data


Title:
SIGNAL TRANSMISSION INSULATION DEVICE AND POWER SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2014/112179
Kind Code:
A1
Abstract:
The present invention pertains to a signal transmission insulation device provided with the following: a first coil; a second coil that faces the first coil and constitutes a transformer along with the first coil; a first insulating film that is provided in a space where the first coil and second coil are opposed, and that comprises a first dielectric; a second insulating film that is provided between a first primary surface of the first coil opposing the second coil and a surface of the first insulating film opposing the first coil, and that comprises a second dielectric having a higher dielectric constant than the first dielectric; and a third insulating film that is provided between a surface of the second coil opposing the first coil and a surface of the first insulating film opposing the second coil, and that comprises a third dielectric having a higher dielectric constant than the first dielectric.

Inventors:
SUGA KENICHI (JP)
TSURIMOTO TAKAO (JP)
SHIOTA HIROKI (JP)
MOROKUMA KENICHI (JP)
NISHIKAWA KAZUYASU (JP)
ORITA SHOICHI (JP)
TAMETANI FUMITAKA (JP)
NISHIDA NOBUYA (JP)
YONEYAMA REI (JP)
INOUE TAKAHIRO (JP)
UOTA SHIORI (JP)
Application Number:
PCT/JP2013/079537
Publication Date:
July 24, 2014
Filing Date:
October 31, 2013
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/822; H01F19/00; H01L21/768; H01L23/532; H01L27/04
Foreign References:
JP2010080774A2010-04-08
JP2001358215A2001-12-26
JP2007258195A2007-10-04
JP2011258876A2011-12-22
JP2008258553A2008-10-23
JP2012015557A2012-01-19
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
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