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Title:
SIGNAL TRANSMISSION INSULATIVE DEVICE AND POWER SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2016/080034
Kind Code:
A1
Abstract:
A signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the first coil and the second coil face one another; a second insulation film surrounding the first coil and comprising a second dielectric body that has a resistivity lower than the first dielectric body; and a third insulation film surrounding the second coil and comprising a third dielectric body that has a resistivity lower than the first dielectric body. Or, the signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the first coil and the second coil face one another; a second insulation film surrounding the first coil and comprising a second dielectric body that has a dielectric constant higher than the first dielectric body; and a third insulation film surrounding the second coil and comprising a third dielectric body that has a dielectric constant higher than the first dielectric body.

Inventors:
SUGA KENICHI (JP)
TSURIMOTO TAKAO (JP)
SHIOTA HIROKI (JP)
MOROKUMA KENICHI (JP)
ORITA SHOICHI (JP)
TAMETANI FUMITAKA (JP)
INOUE TAKAHIRO (JP)
UOTA SHIORI (JP)
Application Number:
PCT/JP2015/073229
Publication Date:
May 26, 2016
Filing Date:
August 19, 2015
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/822; H01F17/00; H01F19/00; H01F27/32; H01L27/04
Domestic Patent References:
WO2014112179A12014-07-24
Foreign References:
JP2009253052A2009-10-29
US20080003699A12008-01-03
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
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