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Title:
SILANOL CONDENSATION CATALYST, HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING PHOTOSEMICONDUCTORS AND SEALED PHOTOSEMICONDUCTOR USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/071092
Kind Code:
A1
Abstract:
Provided are a silanol condensation catalyst which has high heat-resistant coloring stability and excellent thin film curing properties and can reduce a loss on heating, a heat-curable silicone resin composition for sealing photosemiconductors, and a sealed photosemiconductor using the heat-curable silicone resin composition for sealing photosemiconductors. A silanol condensation catalyst which contains at least a zirconium metal salt represented by formula (I) [wherein n represents an integer of 1 to 3; R1s each represents a hydrocarbon group having 1 to 16 carbon atoms; and R2s each represents a hydrocarbon group having 1 to 18 carbon atoms]; a heat-curable silicone resin composition for sealing photosemiconductors, which comprises: (A) 100 parts by mass of a polysiloxane having two or more silanol groups per molecule; (B) 0.1 to 2000 parts by mass of a silane compound having two or more alkoxy groups bonded to a silicon atom per molecule; and (C) a zirconium metal salt represented by formula (I); and a sealed photosemiconductor which is obtained by adding said heat-curable silicone resin composition for sealing photosemiconductors to an LED chip, curing the heat-curable silicone resin composition for sealing photosemiconductors by heating the LED chip, and thus sealing the LED chip.

Inventors:
TAKEI, Yoshihito (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
武井吉仁 (〒01 神奈川県平塚市追分2番1号 横浜ゴム株式会社 平塚製造所内 Kanagawa, 〒2548601, JP)
ISHIKAWA, Kazunori (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
Application Number:
JP2009/070797
Publication Date:
June 24, 2010
Filing Date:
December 08, 2009
Export Citation:
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Assignee:
THE YOKOHAMA RUBBER CO.,LTD. (36-11, Shimbashi 5-chome Minato-k, Tokyo 85, 〒1058685, JP)
横浜ゴム株式会社 (〒85 東京都港区新橋5丁目36番11号 Tokyo, 〒1058685, JP)
TAKEI, Yoshihito (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
武井吉仁 (〒01 神奈川県平塚市追分2番1号 横浜ゴム株式会社 平塚製造所内 Kanagawa, 〒2548601, JP)
International Classes:
H01L23/29; C08G77/08; C08K5/098; C08K5/5415; C08L83/06; H01L23/31
Foreign References:
JP2006206700A2006-08-10
JP2007320998A2007-12-13
JP2008208160A2008-09-11
JP2008094918A2008-04-24
JPS63105058A1988-05-10
JPS6460656A1989-03-07
JPH05331370A1993-12-14
JP2010043136A2010-02-25
JP4385078B12009-12-16
JP2008274272A2008-11-13
JPH02196860A1990-08-03
JP2007224089A2007-09-06
JP2009132797A2009-06-18
Attorney, Agent or Firm:
YAMAMOTO, Yoshiyuki (Intellectual Property Dept., 36-11, Shimbashi 5-chome, Minato-k, Tokyo 85, 〒1058685, JP)
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