Title:
SILICA AND ALSO EPOXY RESINS
Document Type and Number:
WIPO Patent Application WO/2009/109442
Kind Code:
A3
Abstract:
Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175 ± 15 m2/g and a thickening effect, based on the BET surface area, of greater than 18 mPas g/m2 is hydrophobicized with polydimethylsiloxane. This hydrophobic fumed silica has a BET surface area of 110 ± 25 m2/g. It can be used in epoxy resins. These epoxy resins in turn can be used as adhesives.
Inventors:
MEYER JUERGEN (DE)
SCHOLZ MARIO (DE)
BUCKEL PIA (DE)
HILLE ANDREAS (DE)
SCHOLZ MARIO (DE)
BUCKEL PIA (DE)
HILLE ANDREAS (DE)
Application Number:
PCT/EP2009/051475
Publication Date:
August 05, 2010
Filing Date:
February 10, 2009
Export Citation:
Assignee:
EVONIK DEGUSSA GMBH (DE)
MEYER JUERGEN (DE)
SCHOLZ MARIO (DE)
BUCKEL PIA (DE)
HILLE ANDREAS (DE)
MEYER JUERGEN (DE)
SCHOLZ MARIO (DE)
BUCKEL PIA (DE)
HILLE ANDREAS (DE)
International Classes:
C01B33/18; C08K3/36; C09C1/30; C09J11/04; C09J163/00
Foreign References:
EP1681266A2 | 2006-07-19 | |||
EP1302444A1 | 2003-04-16 | |||
EP1433749A1 | 2004-06-30 | |||
US6645341B1 | 2003-11-11 | |||
EP1281735A1 | 2003-02-05 |
Attorney, Agent or Firm:
EVONIK DEGUSSA GMBH (Postcode 84/339Rodenbacher Chaussee 4, Hanau, DE)
Download PDF:
Previous Patent: THERMAL SOLAR SYSTEM
Next Patent: PHOTOVOLTAIC DEVICES WITH HIGH-ASPECT-RATIO NANOSTRUCTURES
Next Patent: PHOTOVOLTAIC DEVICES WITH HIGH-ASPECT-RATIO NANOSTRUCTURES