Title:
SILICA FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/032986
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a silica which has a low dielectric loss tangent and excellent uniform dispersibility in a resin, while achieving high safety. The present invention relates to a material for forming a filler for electronic materials, the material containing an amorphous silica wherein the peak intensity ratio (A/B) of a peak A derived from an isolated hydroxyl group to a peak B derived from a hydroxyl group forming a hydrogen bond is 1.0 to 75.0, and there is substantially no peak derived from adsorbed water in the range from 3,500 to 3,100 cm-1 in an FT-IR measurement.
Inventors:
TANIKAWA HIROKI (JP)
MURAKAMI YASUYUKI (JP)
MURAKAMI YASUYUKI (JP)
Application Number:
PCT/JP2022/032603
Publication Date:
March 09, 2023
Filing Date:
August 30, 2022
Export Citation:
Assignee:
SAKAI CHEMICAL INDUSTRY CO (JP)
International Classes:
C01B33/18; C08K3/36; C08K9/00; C08L63/00
Domestic Patent References:
| WO2011049121A1 | 2011-04-28 |
Foreign References:
| JP2013126925A | 2013-06-27 | |||
| JP2003238141A | 2003-08-27 | |||
| JP2007290904A | 2007-11-08 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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