Title:
SILICA FILM AND SEPARATION FILM FILTER
Document Type and Number:
WIPO Patent Application WO/2016/148132
Kind Code:
A1
Abstract:
A silica film filter 10 is provided with a porous substrate 13 and a silica film 18 that is formed on the porous substrate 13 and contains an aryl group. The ratio of the number of Si atoms to the number of C atoms in the silica film 18, according to an elemental analysis performed using energy-dispersive X-ray spectroscopy (EDX), is 0.2 to 15. The thickness of the silica film 18 is preferably 30 nm to 300 nm. If X is the absorption intensity of a Si-O-Si bond in the Fourier transform infrared (FTIR) absorption spectrum, and Y is the absorption intensity based on the aryl group in said spectrum, the ratio X/Y is preferably in the range of 5.0 to 200.
Inventors:
MIURA AYA (JP)
FURUKAWA MASAHIRO (JP)
FURUKAWA MASAHIRO (JP)
Application Number:
PCT/JP2016/058109
Publication Date:
September 22, 2016
Filing Date:
March 15, 2016
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
B01D71/02; B01D69/00; B01D69/02; B01D69/10; B01D69/12; C01B33/12
Domestic Patent References:
| WO2013129625A1 | 2013-09-06 | |||
| WO2013146622A1 | 2013-10-03 |
Foreign References:
| JP2013226541A | 2013-11-07 | |||
| JP2013128886A | 2013-07-04 | |||
| JP2001212401A | 2001-08-07 | |||
| JP2010506698A | 2010-03-04 | |||
| JP2009255035A | 2009-11-05 | |||
| JPH01304006A | 1989-12-07 | |||
| JPH03143535A | 1991-06-19 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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