Title:
SILICA, METHOD FOR PRODUCING SILICA ABRASIVE, AND METHOD FOR PRODUCING GLASS SUBSTRATE FOR MAGNETIC DISC
Document Type and Number:
WIPO Patent Application WO/2015/046603
Kind Code:
A1
Abstract:
Provided is a silica abrasive with which there is no danger of scratching the object to be polished, and which does not cause a reduction in polishing speed. This silica abrasive has a ratio [(Si-OH)/Si] of silanol groups (Si-OH) within the abrasive to elemental silica (Si) of the abrasive as a whole of at least 0.4.
Inventors:
TOKUMITSU SHUZO (JP)
Application Number:
PCT/JP2014/076199
Publication Date:
April 02, 2015
Filing Date:
September 30, 2014
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
G11B5/84; B24B37/00; C09K3/14
Foreign References:
| JP2009224771A | 2009-10-01 | |||
| JP2009224767A | 2009-10-01 | |||
| JP2006231436A | 2006-09-07 | |||
| JP2011181884A | 2011-09-15 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
Global IP Tokyo patent business corporation (JP)
Global IP Tokyo patent business corporation (JP)
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