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Title:
SILICA PARTICLES, PROCESS FOR PRODUCTION OF SAME, AND RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2011/093142
Kind Code:
A1
Abstract:
Disclosed are: silica particles which have a sharp particle size distribution and a low water absorption rate and can be used suitably as a filler for a sealing resin composition; a process for producing the silica particles; and a resin composition comprising the silica particles and a resin. The silica particles have a water absorption rate of less than 1.0% when measured for 500 hours under the conditions of a temperature of 50˚C and a humidity of 90% and the conditions of a temperature of 85°C and a humidity of 85%, a D90/D10 value of 3 or less, a true specific gravity of 2.1 g/cm3 or more, and an average particle diameter of 10 μm or less.

Inventors:
MATSUKUBO TAKANORI (JP)
NAKAGAWA KEN-ICHI (JP)
SUZUKI MASAHIRO (JP)
Application Number:
PCT/JP2011/050491
Publication Date:
August 04, 2011
Filing Date:
January 14, 2011
Export Citation:
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Assignee:
SAKAI CHEMICAL INDUSTRY CO (JP)
MATSUKUBO TAKANORI (JP)
NAKAGAWA KEN-ICHI (JP)
SUZUKI MASAHIRO (JP)
International Classes:
C01B33/18; C08K9/06; C08L101/00
Foreign References:
JP2003176121A2003-06-24
JP2008137854A2008-06-19
JPH10287415A1998-10-27
JP2002182409A2002-06-26
JP2009215088A2009-09-24
JPH06254383A1994-09-13
JPH0431311A1992-02-03
JPS63265806A1988-11-02
JP2003277044A2003-10-02
JP2008285406A2008-11-27
JP2003277025A2003-10-02
JP2003165718A2003-06-10
JPH09208809A1997-08-12
JP2002338230A2002-11-27
Attorney, Agent or Firm:
YAGI, Toshiyasu (JP)
Toshiyasu Yagi (JP)
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Claims:



 
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