Title:
SILICALITE, COMPOSITON, LIQUID-STATE SEALING AGENT, RESIN COMPOSITE, SEALING MATERIAL, SEALING MATERIAL PRODUCTION METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/210791
Kind Code:
A1
Abstract:
This silicalite is spherical and has a particle size of 0.4-20 μm. The present invention can provide: a silicalite having a low rate of moisture absorption; and a low-viscosity composition that has a low thermal expansion coefficient after being cured.
Inventors:
OHNISHI RYOHJI (JP)
NAKANO MATSUNAGA CHIE (JP)
KATAGIRI NORIKO (JP)
MATSUI JUN (JP)
TAKEWAKI TAKAHIKO (JP)
NAKANO MATSUNAGA CHIE (JP)
KATAGIRI NORIKO (JP)
MATSUI JUN (JP)
TAKEWAKI TAKAHIKO (JP)
Application Number:
PCT/JP2023/016776
Publication Date:
November 02, 2023
Filing Date:
April 27, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C01B37/02; C08K3/34; C08K7/18; C08L63/00; C08L79/08; C08L101/00; H01L21/56; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| WO2019245054A1 | 2019-12-26 |
Foreign References:
| KR20040102643A | 2004-12-08 | |||
| JP2017225917A | 2017-12-28 | |||
| JPS5824353A | 1983-02-14 | |||
| JP2018178112A | 2018-11-15 | |||
| JPS5472795A | 1979-06-11 | |||
| JP2007332004A | 2007-12-27 | |||
| JP2001518437A | 2001-10-16 |
Other References:
DIBLÍKOVÁ P., VESELÝ M., SYSEL P., ČAPEK P.: "Reconstructing the microstructure of polyimide–silicalite mixed‐matrix membranes and their particle connectivity using FIB‐SEM tomography", JOURNAL OF MICROSCOPY, BLACKWELL SCIENCE, GB, vol. 269, no. 3, 1 March 2018 (2018-03-01), GB , pages 230 - 246, XP093104949, ISSN: 0022-2720, DOI: 10.1111/jmi.12618
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF: