Title:
SILICIDE-REINFORCED COPPER-TITANIUM ALLOY MATRIX COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/000510
Kind Code:
A1
Abstract:
Disclosed in the present invention are a silicide-reinforced copper-titanium alloy matrix composite material and a preparation method therefor. The composite material comprises a copper-titanium alloy matrix and silicide particles dispersed in the copper-titanium alloy matrix, wherein the content of the silicide particles is 0.1-2.0 wt%. The silicide particles comprise 15-30 wt% of Si, and the balance of Ti, Cu and inevitable impurities. The copper-titanium alloy matrix comprises 1.0-5.0 wt% of Ti, 0.001-0.1 wt% of Si, and the balance of Cu and inevitable impurities. The composite material has good hardness, wear resistance and structure stability, and does not contain the magnetic elements of Fe, Co, and Ni. The present invention further relates to the method for preparing the composite material.
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Inventors:
TANG NING (CN)
ZHI YUEPENG (CN)
ZHANG MING (CN)
LI NING (CN)
WU BO (CN)
YANG JIAN (CN)
LIU JIASONG (CN)
WANG HAIMIN (CN)
ZHI YUEPENG (CN)
ZHANG MING (CN)
LI NING (CN)
WU BO (CN)
YANG JIAN (CN)
LIU JIASONG (CN)
WANG HAIMIN (CN)
Application Number:
PCT/CN2021/123180
Publication Date:
January 26, 2023
Filing Date:
October 12, 2021
Export Citation:
Assignee:
NINGBO BOWAY ALLOY PLATE & STRIP CO LTD (CN)
NINGBO BOWAY ALLOY MAT CO LTD (CN)
NINGBO BOWAY ALLOY MAT CO LTD (CN)
International Classes:
C22C9/00; C22C1/10; C22C32/00
Foreign References:
| CN107021491A | 2017-08-08 | |||
| CN108220659A | 2018-06-29 | |||
| CN111485129A | 2020-08-04 | |||
| CN112126815A | 2020-12-25 | |||
| CN106048306A | 2016-10-26 | |||
| CN112322926A | 2021-02-05 |
Other References:
WANG QIANG: "Research on Preparation and Microstructures of （TiC+Ti5Si3） Reinforced Copper Matrix Composites", CHINA MASTER'S' THESES FULL-TEXT DATABASE (ELECTRONIC JOURNAL)-INFORMATION & TECHNOLOGY), TIANJIN POLYTECHNIC UNIVERSITY, CN, no. 1, 15 January 2020 (2020-01-15), CN , XP093027259, ISSN: 1674-0246
LIU QING, ZHANG XIAO-CUI, WANG QIANG, MIAO WEN-ZHI, LI CHUN-YAN, DING HAI-MIN: "Microstructure evolution of Ti5Si3 in Cu-Ti-Si alloys", CHINA FOUNDRY, FOUNDRY JOURNAL AGENCY, CN, vol. 17, no. 4, 1 July 2020 (2020-07-01), CN , pages 286 - 292, XP093027257, ISSN: 1672-6421, DOI: 10.1007/s41230-020-9140-4
LIU QING, ZHANG XIAO-CUI, WANG QIANG, MIAO WEN-ZHI, LI CHUN-YAN, DING HAI-MIN: "Microstructure evolution of Ti5Si3 in Cu-Ti-Si alloys", CHINA FOUNDRY, FOUNDRY JOURNAL AGENCY, CN, vol. 17, no. 4, 1 July 2020 (2020-07-01), CN , pages 286 - 292, XP093027257, ISSN: 1672-6421, DOI: 10.1007/s41230-020-9140-4
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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