Title:
SILICON-BASED FAN-OUT PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/241848
Kind Code:
A1
Abstract:
A silicon-based fan-out packaging structure comprising an embedded manifold-type microfluidic channel, comprising: a chip (100) that comprises a substrate (101) and embedded microfluidic channels (102) located on the back of the substrate; a silicon-based adapter plate (200) that comprises a groove (206) for embedding a chip, a manifold channel (203) located below the groove and communicated with the groove, a liquid inlet (201), and a liquid outlet (202); a low-temperature sealing layer used for enabling the embedded microfluidic channels and the manifold channel to be in sealing communication, the low-temperature sealing layer being located between the chip and the silicon-based adapter plate; and a redistribution layer (300) located at the top of the chip. A preparation method for a silicon-based fan-out packaging structure comprising an embedded manifold-type microfluidic channel is disclosed. The silicon-based fan-out packaging structure of the present invention has low-temperature process compatibility and package compatibility, and has high heat-dissipation efficiency. The embedded manifold-type microfluidic channel of the present invention has the advantages of being short in flow distance, small in flow resistance and small in thermal resistance, and is more suitable for integration in a high-power chip for efficient heat dissipation.
Inventors:
WANG WEI (CN)
YANG YUCHI (CN)
DU JIANYU (CN)
YANG YUCHI (CN)
DU JIANYU (CN)
Application Number:
PCT/CN2021/097815
Publication Date:
November 24, 2022
Filing Date:
June 02, 2021
Export Citation:
Assignee:
UNIV BEIJING (CN)
International Classes:
H01L23/31; H01L23/367; H01L23/473; H01L23/498
Foreign References:
| CN111769087A | 2020-10-13 | |||
| CN108766897A | 2018-11-06 | |||
| CN109524373A | 2019-03-26 | |||
| CN112768432A | 2021-05-07 | |||
| CN112234037A | 2021-01-15 |
Attorney, Agent or Firm:
BEIJING CHEN QUAN INTELLECTUAL PROPERTY LAW FIRM (CN)
Download PDF:
Previous Patent: GATE DRIVE CIRCUIT AND DISPLAY PANEL
Next Patent: FERROMAGNETIC OBJECT DETECTION APPARATUS AND METHOD FOR DETECTING TUBING COUPLING
Next Patent: FERROMAGNETIC OBJECT DETECTION APPARATUS AND METHOD FOR DETECTING TUBING COUPLING