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Title:
A SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME
Document Type and Number:
WIPO Patent Application WO/2013/097135
Kind Code:
A1
Abstract:
A silicon based MEMS microphone comprises a silicon substrate (100) and an acoustic sensing part (11) supported on the silicon substrate, wherein a mesh-structured back hole (140) is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams (141) which are interconnected with each other and supported on the sidewall (142) of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes (143) which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone.

Inventors:
WANG ZHE (SG)
CAI MENGJIN (CN)
Application Number:
PCT/CN2011/084889
Publication Date:
July 04, 2013
Filing Date:
December 29, 2011
Export Citation:
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Assignee:
GOERTEK INC (CN)
WANG ZHE (SG)
CAI MENGJIN (CN)
International Classes:
B81B7/00; B81C1/00; H04R7/00; H04R19/04
Foreign References:
CN1352515A2002-06-05
CN101631739A2010-01-20
US20100090298A12010-04-15
US20040146810A12004-07-29
Attorney, Agent or Firm:
BEIJING GRANDER IP LAW FIRM (East Wing Hanwei Plaza,No.7 Guanghua Road,Chaoyang District, Beijing 4, CN)
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Claims: