SILICON COMPOUND, REACTIVE MATERIAL, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, PATTERN CURED FILM, AND METHOD FOR PRODUCING PATTERN CURED FILM

WIPO Patent Application WO/2021/085262

A1

Provided is a silicon compound represented by general formula (x). Also provided is a reactive material comprising a silicon compound represented by general formula (x). In general formula (x), R1 represents or, when there are a plurality of the residues, independently represent a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkenyl group having 2 to 10 carbon atoms, a branched alkenyl group having 3 to 10 carbon atoms, or a cyclic alkenyl group having 3 to 10 carbon atoms, wherein all or some of hydrogen atoms in the alkyl group or the alkenyl group may be substituted by fluorine atoms; R2 represents or, when there are a plurality of the residues, independently represent a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 to 4 carbon atoms, wherein all or some of hydrogen atoms in the alkyl group may be substituted by fluorine atoms; RA represents an acid-labile group; a represents an integer of 1 to 3, b represents an integer of 0 to 2, and c represents an integer of 1 to 3, wherein a+b+c = 4; and n represents an integer of 1 to 5.

MASUBUCHI TAKASHI (JP)
OIKAWA YURI (JP)
YAMANAKA KAZUHIRO (JP)

PCT/JP2020/039508

May 06, 2021

October 21, 2020

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CENTRAL GLASS CO LTD (JP)

C08G77/24; C07F7/18; C08L83/04; G03F7/004; G03F7/075; G03F7/20

WO2020090746A1

2020-05-07

JP6323225B2	2018-05-16
JP2002308990A	2002-10-23
JP2005031564A	2005-02-03

HAYAMI Shinji (JP)

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