Title:
SILICON RECLAMATION APPARATUS AND METHOD OF RECLAIMING SILICON
Document Type and Number:
WIPO Patent Application WO/2008/053696
Kind Code:
A1
Abstract:
A silicon reclamation apparatus with which a large amount of silicon can be easily
reclaimed from a waste slurry. The silicon reclamation apparatus comprises:
a solid-liquid separation part in which either a waste slurry discharged from
a cutting device or polishing device in which a slurry comprising abrasive grains
and a coolant is used for silicon cutting or polishing or a waste slurry concentrate
obtained by concentrating the waste slurry is subjected to solid-liquid separation
to obtain solid substances for silicon recovery; a washing part in which the solid
substances for silicon recovery are washed with an organic solvent; and a classification
part in which the solid substances for silicon recovery after the washing are
classified to obtain a silicon-containing powder having a higher silicon content
than before the classification.
Inventors:
KAJIMOTO, Kimihiko (())
梶本 公彦 (())
梶本 公彦 (())
Application Number:
JP2007/070092
Publication Date:
May 08, 2008
Filing Date:
October 15, 2007
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 5458522, JP)
KAJIMOTO, Kimihiko (())
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 5458522, JP)
KAJIMOTO, Kimihiko (())
International Classes:
C01B33/037; B03C1/00; B07B9/00; C02F11/12
Attorney, Agent or Firm:
NOGAWA, Shintaro (Nogawa Patent Office, Minamimorimachi Park Bldg.1-3, Nishitenma 5-chome,Kita-ku, Osaka-shi, Osaka, 530-0047, JP)
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