SILICON SUBSTRATE INTERMEDIATE POLISHING COMPOSITION AND SILICON SUBSTRATE POLISHING COMPOSITION SET

Title:

SILICON SUBSTRATE INTERMEDIATE POLISHING COMPOSITION AND SILICON SUBSTRATE POLISHING COMPOSITION SET

Document Type and Number:

WIPO Patent Application WO/2018/150945

Kind Code:

A1

Abstract:

Provided is a polishing composition which is used in a step upstream of a final polishing step for a silicon substrate, and which makes it possible to obtain a high-quality surface effectively after the final polishing step. According to the present invention, there is provided an intermediate polishing composition which is used in an intermediate polishing step of a silicon substrate polishing process comprising the intermediate polishing step and the final polishing step. The intermediate polishing composition includes abrasive grains A1, a basic compound B1, and a surface protection agent S1. The surface protection agent S1 includes a water-soluble polymer P1 having a weight-average molecular weight of more than 30 × 104 and a dispersant D1, wherein a dispersive parameter α1 is less than 80%.

Inventors:

TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
MOMOTA SATOSHI (JP)

Application Number:

PCT/JP2018/003971

Publication Date:

August 23, 2018

Filing Date:

February 06, 2018

Export Citation:

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Assignee:

FUJIMI INC (JP)

International Classes:

H01L21/304; B24B37/00; C09K3/14

Domestic Patent References:

WO2015194136A1	2015-12-23
WO2008044477A1	2008-04-17

Foreign References:

JP2005518668A	2005-06-23
JP2016039179A	2016-03-22
JP2017029153A	2017-02-09
JP2012089862A	2012-05-10
JP2015124231A	2015-07-06
JP2016004953A	2016-01-12

Other References: