Title:
SILICON WAFER EVALUATION METHOD, SILICON WAFER MANUFACTURING PROCESS EVALUATION METHOD, SILICON WAFER MANUFACTURING METHOD, AND SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2018/061337
Kind Code:
A1
Abstract:
Provided is a silicon wafer evaluation method including: a first determination for determining whether or not there is an abnormality, through inspecting the surface of a silicon wafer to be evaluated by a light scattering type surface inspection device; and a second determination for determining whether or not there is an abnormality, through observing, by an atomic force microscope, an area, of the surface of the silicon wafer to be evaluated, where the presence of an abnormality has not been confirmed in the first determination.
Inventors:
MORI KEIICHIRO (JP)
Application Number:
PCT/JP2017/021885
Publication Date:
April 05, 2018
Filing Date:
June 14, 2017
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/66; G01N21/956; G01Q60/24
Domestic Patent References:
WO2014115586A1 | 2014-07-31 |
Foreign References:
JPH11354598A | 1999-12-24 | |||
JP2013038435A | 2013-02-21 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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