SILICON-WAFER POLISHING COMPOSITION AND SILICON-WAFER POLISHING METHOD

WIPO Patent Application WO/2011/142362

A1

Disclosed is a silicon-wafer polishing composition that contains silica, a basic substance, a chelating agent, and water. The chelating agent comprises at least one species selected from a group comprising ethylenediamine-N,N'-di(o-hydroxyphenylacetic acid), 1,4,7,10-tetraazacyclododecane-N,N',N",N‴-tetraacetic acid, and salts thereof.

ARAKI, Fumiaki (NISSAN CHEMICAL INDUSTRIES LTD., 11-1, Kitasode, Sodegaura-sh, Chiba 66, 〒2990266, JP)
荒木　文明 (〒66 千葉県袖ケ浦市北袖１１番１　日産化学工業株式会社　機能材料研究所内 Chiba, 〒2990266, JP)
ISHIMIZU, Eiichirou (7-1, Kanda Nishiki-cho 3-chome, Chiyoda-k, Tokyo 54, 〒1010054, JP)
石水　英一郎 (〒54 東京都千代田区神田錦町３丁目７番地１　日産化学工業株式会社内 Tokyo, 〒1010054, JP)

JP2011/060775

November 17, 2011

May 10, 2011

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NISSAN CHEMICAL INDUSTRIES, LTD. (7-1 Kanda Nishiki-cho 3-chome, Chiyoda-ku Tokyo, 54, 〒1010054, JP)
日産化学工業株式会社 (〒54 東京都千代田区神田錦町３丁目７番地１ Tokyo, 〒1010054, JP)
ARAKI, Fumiaki (NISSAN CHEMICAL INDUSTRIES LTD., 11-1, Kitasode, Sodegaura-sh, Chiba 66, 〒2990266, JP)
荒木　文明 (〒66 千葉県袖ケ浦市北袖１１番１　日産化学工業株式会社　機能材料研究所内 Chiba, 〒2990266, JP)
ISHIMIZU, Eiichirou (7-1, Kanda Nishiki-cho 3-chome, Chiyoda-k, Tokyo 54, 〒1010054, JP)

H01L21/304; B24B37/00; C09K3/14

KURIHARA, Hiroyuki et al. (Kurihara International Patent Office, Iwasaki Bldg. 6F 3-15, Hiroo 1-chome, Shibuya-k, Tokyo 12, 〒1500012, JP)

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