Title:
SILICON WAFER POLISHING METHOD AND SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2010/140671
Kind Code:
A1
Abstract:
Disclosed is a silicon wafer polishing method wherein a high planarity can be achieved as in conventional polishing methods, and furthermore, generation of defects due to the residual of a substance contained in a polishing liquid on a wafer surface can be suppressed. A polished silicon wafer is also disclosed.
In the silicon wafer polishing method, the surface of a silicon wafer is polished by supplying the polishing liquid, which contains abrasive grains, to the surface of a polishing pad and relatively sliding the polishing pad with respect to the silicon wafer. The number of the abrasive grains contained in the polishing liquid is 5×1013/cm3 or less.
Inventors:
MATSUDA, Shuhei (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
松田 脩平 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
IWASHITA, Tetsuro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
岩下 哲郎 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
TANIMOTO, Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
松田 脩平 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
IWASHITA, Tetsuro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
岩下 哲郎 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
TANIMOTO, Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
Application Number:
JP2010/059487
Publication Date:
December 09, 2010
Filing Date:
May 28, 2010
Export Citation:
Assignee:
SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
MATSUDA, Shuhei (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
松田 脩平 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
IWASHITA, Tetsuro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
岩下 哲郎 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
MATSUDA, Shuhei (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
松田 脩平 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
IWASHITA, Tetsuro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
岩下 哲郎 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
International Classes:
H01L21/304; B24B37/00
Attorney, Agent or Firm:
SUGIMURA, Kenji (36F Kasumigaseki Common Gate West, 3-2-1 Kasumigaseki, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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