Title:
SILICON WAFER PROCESSING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2018/196838
Kind Code:
A1
Abstract:
Disclosed is a silicon wafer processing device; a pre-aligned optical assembly (3) and an edge exposure assembly (5) are provided on a synchronous bi-directional motion module (4), reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit (7) and a position compensation unit (8) on a bottom plate (1) are controlled by means of a control assembly (2), so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers (9) of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.
Inventors:
WANG GANG (CN)
SHI YICHAO (CN)
JIANG JIE (CN)
HUANG DONGLIANG (CN)
SONG HAIJUN (CN)
SHI YICHAO (CN)
JIANG JIE (CN)
HUANG DONGLIANG (CN)
SONG HAIJUN (CN)
Application Number:
PCT/CN2018/084774
Publication Date:
November 01, 2018
Filing Date:
April 27, 2018
Export Citation:
Assignee:
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD (CN)
International Classes:
H01L21/67; G03F7/20; G03F9/00
Foreign References:
| CN105632971A | 2016-06-01 | |||
| CN105372941A | 2016-03-02 | |||
| KR20060107986A | 2006-10-17 | |||
| US20050248754A1 | 2005-11-10 | |||
| US7901854B2 | 2011-03-08 |
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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