SILICON WAFER FOR SOLAR CELLS AND PRODUCTION METHOD THEREFOR

Title:

SILICON WAFER FOR SOLAR CELLS AND PRODUCTION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2011/024910

Kind Code:

A1

Abstract:

Disclosed is a silicon wafer for solar cells that has a plurality of similarly-oriented, minute, linear depressions that are saw marks formed upon the front and back surfaces of the wafer, whereby the light receiving area of the wafer is expanded and high photoelectric conversion efficiency can be obtained. Furthermore, projection/depression formation processes other than slicing are simplified, and the production cost for silicon solar cells is reduced.

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Inventors:

NAKASHIMA AKIRA (JP)
KAIGA YUKINOBU (JP)
MURATA YUKI (JP)

Application Number:

PCT/JP2010/064510

Publication Date:

March 03, 2011

Filing Date:

August 26, 2010

Export Citation:

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Assignee:

SUMCO CORP (JP)
NAKASHIMA AKIRA (JP)
KAIGA YUKINOBU (JP)
MURATA YUKI (JP)

International Classes:

H01L31/04; B28D5/04; H01L21/304

Domestic Patent References:

WO2009041266A1

2009-04-02

Foreign References:

JPH1044141A	1998-02-17
JP2007180527A	2007-07-12
JPH10256581A	1998-09-25
JPH03276682A	1991-12-06

Attorney, Agent or Firm:

ABE Itsurou (JP)
Itsuro Abe (JP)

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