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Title:
SILICON WAVEGUIDE COUPLING ALIGNMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/000510
Kind Code:
A1
Abstract:
A silicon waveguide coupling alignment device comprises a fine tuning rack (5), a stress releasing fixture (6, 9) and a silicon photonic integrated chip force sensor (4), wherein a silicon photonic integrated chip (3) is fixed on the silicon photonic integrated chip force sensor (4), at least a part of an optical fiber for coupling (2) is fixed on one end of the stress releasing fixture (6, 9), the stress releasing fixture (6, 9) is arranged on the fine tuning rack (5), an end surface of the optical fiber for coupling (2) is aligned with an end surface of the silicon photonic integrated chip (3) by adjusting the position of the fine tuning rack (5), a cushioning mechanism is arranged within the stress releasing fixture (6, 9) to cushion a collision force in a direction perpendicular to the end surface of the optical fiber for coupling (2); the optical fiber end fixture has a stress releasing effect, and the force of contact of the optical fiber exerted on the end surface of the chip can be easily released by means of the fixture, thereby guaranteeing that damages to the end surface of the chip due to an overlarge collision force of the optical fiber are avoided.

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Inventors:
SONG QIONGHUI (CN)
HUANG JIECONG (CN)
LING JIUHONG (CN)
DU WEI (CN)
MA WEIDONG (CN)
Application Number:
PCT/CN2015/097436
Publication Date:
January 05, 2017
Filing Date:
December 15, 2015
Export Citation:
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Assignee:
ACCELINK TECH CO LTD (CN)
International Classes:
G02B6/42
Foreign References:
CN104932066A2015-09-23
CN104122633A2014-10-29
CN104155730A2014-11-19
CN102520493A2012-06-27
JP2005316029A2005-11-10
Attorney, Agent or Firm:
BEIJING TIAN QI ZHI XIN INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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